CMP for 200mm and 300mm Failure Analysis and R&D

Strasbaugh's 6EG CMP system is an economical tool for CMP research, Whole Wafer Deconstruct™ for failure analysis, and low-volume production. Its semi-automatic operations are programmable through a color, touch-screen GUI for repeatable and accurate process control. Featuring advanced technologies, the nHance ViPRR™ Carrier and Hydro-Lift Load Station™ minimize contamination and deliver superior, center-to-edge uniformity. The 6EG uses the same process control methods, wafer carrier, load station, and pad conditioner as Strasbaugh's fully-automated 6DS-SP CMP system, easing the transition from development to production. The 6EG is the affordable solution, providing the benefits of state-of-the-art CMP at a low cost. 6EG Benefits Failure Analysis & Yield Enhancement via the 6EG's WholeWaferDeconstruct process CMP Process recipes are transferable to Strasbaugh's fully automated 200mm 6DS-SP system for high-volume production ViPRR carriers reduce edge exclusion, control center-to-edge uniformity, and improve overall performance and reliability Hydro-Lift Load Station and spindle flush eliminate front-side contact and reduce contamination Programmable pad conditioning increases the lifetime of the pad and improves WIWNU operations are programmable through a color, touchscreen GUI Minimal maintenance lowers the cost of ownership Small footprint makes the 6EG system convenient for small labs To request more information on Strasbaugh's 6EG CMP system, click here.