CMP for 200mm and 300mm Whole Wafer Failure Analysis

Strasbaugh's 6EC CMP system is an excellent tool for WholeWaferDeconstruct™, a whole wafer sample preparation technique for frontside failure analysis and yield enhancement. Its semi-automatic operations are programmable through a color, touch-screen GUI for repeatable and accurate process control. 6EG Benefits Failure Analysis & Yield Enhancement via the n6EG's WholeWaferDeconstruct process ViPRR carriers reduce edge exclusion, control center-to-edge uniformity, and improve overall performance and reliability Hydro-Lift Load Station and spindle flush eliminate front-side contact and reduce contamination Programmable pad conditioning increases the lifetime of the pad and improves WIWNU Operations are programmable through a color, touchscreen GUI Minimal maintenance lowers the cost of ownership Small footprint makes the 6EG system convenient for small labs To request more information on Strasbaugh's 6EG CMP system, click here.