CMP for Whole Wafer Failure Analysis and Yield Enhancement

Strasbaugh's 6EC CMP system is an excellent tool for WholeWaferDeconstruct™, a whole wafer sample preparation technique for frontside failure analysis. Its semi-automatic operations are programmable through a color, touch-screen GUI for repeatable and accurate process control. Featuring advanced technologies, the 6EC's ViPRR™ Carrier and Hydro-Lift Load Station™ minimize contamination and deliver superior, center-to-edge uniformity. 6EC Benefits Operations are programmable through a color, touchscreen GUI Process recipes are transfer-able to Strasbaugh's fully automated 6DS-SP CMP system for high-volume production ViPRR carriers reduce edge exclusion, control center-to- edge uniformity, and improve overall performance and reliability Hydro-Lift Load Station and spindle flush eliminate front- side contact and reduce contamination Closed-loop table and spindle RPM motors help ensure consistent process results Programmable pad conditioning increases the lifetime of the pad and improves WIWNU Minimal maintenance lowers the cost of ownership Small footprint makes the 6EC convenient for small labs Pad conditioning system provides in-situ and/or ex-situ programmable selective pad conditioning for consistent removal rates and minimum non-uniformity. 20 zones of programmable control: dwell time, downforce and RPM can be programmed for each zone. Pad conditioning can be done with a diamond plated disk or nylon brush. To request more information on Strasbaugh's 6EC CMP, click here.