A Better Choice in Final Haze Removal for 300mm Silicon Prime Wafer Production
The STB P300 is the semiconductor industry’s first siliocon polishing system designed to incorporate Next Generation Factory principles.  It combines the greatest production and process flexibility of any polisher on the market with the most advanced polishing technologies available in the industry's most proven rotary platform.  With industry-leading process performance, a compact footprint, low cost of ownership, and higher yields, the STB P300 offers wafer manufacturers a new and better choice in silicon polishing.   STB P300 Benefits Greatest Production and Process Flexibility Built for High Volume Production Ultra Low Downforce Process Capability Reliable Small Footprint Reduces Setup Time and FWD Low Cost of Ownership Handles 150mm, 200mm, or 300mm Wafers
STB P300 Technologies Independent Turrets Advanced Wafer Carriers Multi-zone Back Pressure Ultra-Precise Pad Conditioning To request more information on Strasbaugh’s STB P300 polisher, click here.