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7AA-II 150MM WAFER GRINDER

 Advanced Wafer Grinding Capability for 150mm Wafers and Smaller

Strasbaugh's 7AA-II wafer grinder is an automated infeed grinder capable of performing a wide variety of grinding applications on wafers ranging from 75 to 150mm in diameter. Strasbaugh pioneered infeed vertical grinding technology, a method now universally applied by all wafer grinder manufacturers. This technique removes stock from the wafer rapidly and uniformly while minimizing stress and warpage.  The 7AA-II can meet the most stringent stock removal, flatness, and surface finish requirements.

To request more information on Strasbaugh's 7AA-II wafer grinder, click here.

     
 
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