Strasbaugh Has 60 Years of Surface Grinding and Polishing Experience

Introduction Strasbaugh brings a host of experience working with hard and brittle materials to LED manufacuturing applications, along with two advanced wafer grinders and a state-of-the-art CMP systems.   Our 7AF and 7AA-II wafer grinders, which feature Strasbaugh’s Force Adaptive, In-feed Grinding technology, are specially equipped to handle hard materials, such as silicon carbide and sapphire, as well as substrates as small as 50mm.   Strasbaugh’s solution provides a significant advantage over conventional lapping techniques. By processing substrates individually, while maintaining production volumes comparable to lapping, product quality and consistency are greatly enhanced.   Strasbaugh's 6EC CMP system removes sub-surface damage induced by grinding and achieves the required surface finish.  Key Grinding Technologies Force Adaptive, In-feed wafer grinding technology limits grind force, protecting fragile substrates, while optimizing throuhgput  In-situ thickness measurement improves TTV and ensures wafer-to-wafer consistency Automated small wafer substrate handling capability for 50mm, 75mm, and 100mm Key CMP Technologies Advanced wafer carriers improve uniformity and reduce edge exclusion Multi-zone back pressure further improves within-wafer uniformity and center-to-edge process performance Powered Pad Conditioner increases pad life and improves uniformity  Applications Sapphire SiC Other Compound Semiconductor Consumables R&D Process R&D Substrate Sizes 50mm to 200mm Notched, flatted, and round substrates accommodated LED Products 7AF 200mm Wafer Grinder 7AA-II 150mm Low- volume Wafer Grinder 6EC 200mm R&D CMP