Strasbaugh is the Leading Supplier of CMP Equipment to the US Data Storage Industry

Introduction Strasbaugh’s Wafer Reclaim equipment is designed for high reliability, superior process performance and low cost of ownership. Our affordable CMP and grinding systems are fully automated and equipped with state-of-the-art technologies and can handle virtually any material encountered in Wafer Reclaim.   Strasbaugh offers the STB P300 and 6DS-SP CMP systems and the 7AF wafer grinder for Wafer Reclaim.   Key CMP Technologies Advanced wafer carriers improve uniformity and reduce edge exclusion Multi-zone back pressure further improves within-wafer uniformity and center-to-edge process performance Defectivity controls reduce contamination and increase yield Key Grinding Technologies Force Adaptive, In-feed wafer grinding technology limits grind force, protecting fragile substrates, while optimizing throuhgput  In-situ thickness measurement improves TTV and ensures wafer-to-wafer consistency Applications Tungsten Oxide STI Copper Silicon Compound Semiconductor Wafer Sizes 75mm to 300mm Notched, flatted, and round wafers accommodated Products STB P300™ 300mm Production CMP 6DS-SP 200mm Production CMP 7AF 200mm Production Wafer Grinder