Strasbaugh Offers Two Revolutionary Sample Preparation Techniques for Failure Analysis

Introduction Strasbaugh's WholeWaferDeconstruct™ (WWD) process prepares the entire surface of the wafer for frontside failure analysis and yield enhancement.  WWD is faster, more accurate and more repeatable than conventional sample preparation techniques.     Key Technologies Frontside sample preparation capability Self-stopping frontside preparation process – WholeWaferDeconstruct™ Menu-driven automated process control Advanced carrier technology maintains wafer uniformity and edge exclusion Applications Oxide Tungsten STI Copper Silicon Flip Chip Wafer Sizes 100mm to 300mm Notched, flatted, round, and square substrates accommodated Products 6EG 300mm WholeWaferDeconstruct 6EC 200mm WholeWaferDeconstruct